Low-Resistance and high-Strength Copper Direct Bonding in no-Vacuum Ambient Using Highly (111)-Oriented Nano-Twinned Copper-Reference-Cited by-同舟云学术

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Low-Resistance and high-Strength Copper Direct Bonding in no-Vacuum Ambient Using Highly (111)-Oriented Nano-Twinned Copper

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Juang Jing Ye,Shie Kai Cheng,Hsu Po-Ning,Li Yu Jin,Tu K N,Chen Chih

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811233.pdf?arnumber=8811233

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low temperature Cu–Cu direct bonding in air ambient by ultrafast surface grain growth;Royal Society Open Science;2024-09

2. Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu;ACTA METALL SIN;2024

3. Electromigration in three-dimensional integrated circuits;Applied Physics Reviews;2023-05-16

4. Investigation of Cu-Cu Direct Bonding Process Utilized by High Porosity and Nanocrystal Structure;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. The self-healing of Kirkendall voids on the interface between Sn and (1 1 1) oriented nanotwinned Cu under thermal aging;Applied Surface Science;2022-06

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