Author:
Yamatsu Shigeru,Watanabe Kazuki,Kanagawa Naoki,Ishikawa Takatoshi,Kojio Teppei
Cited by
3 articles.
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1. Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
2. High throughput two-stage bonding technique for advanced wafer level packaging;2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC);2019-09
3. Ultrasonic Bonding Technology for Micro System Integration;Journal of The Japan Institute of Electronics Packaging;2019-08-01