Author:
Sun Yunheng,Cai Han,Li Jiwei,Ma Shenglin,Jin Yufeng,Wang Wei,Chen Jing,Miao Min,Hu Liulin,He Shuwei
Cited by
4 articles.
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1. A High Coupling Coefficient Transformer Based on Coaxial TSV;2023 6th International Conference on Electronics Technology (ICET);2023-05-12
2. Miniature and Symmetrical Transformer Based on Through-Silicon Vias;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-10
3. A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-01
4. HR-Si TSV integrated inductor;TSV 3D RF Integration;2022