TCAD-Enabled Machine Learning Defect Prediction to Accelerate Advanced Semiconductor Device Failure Analysis
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8863874/8870352/08870440.pdf?arnumber=8870440
Cited by 21 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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4. Automatic TCAD Model Parameter Calibration using Autoencoder;2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD);2023-09-27
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