Characterization of Packaging Stress with a Capacitive Stress Sensor Array
Author:
Affiliation:
1. Bilkent University,Department of Electrical and Electronics Engineering,Ankara,Turkey
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10052111/10052113/10052529.pdf?arnumber=10052529
Reference10 articles.
1. Advanced MEMS Process for Wafer Level Hermetic Encapsulation of MEMS Devices Using SOI Cap Wafers With Vertical Feedthroughs
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3. Plane-shear measurement with strain gauges,2022
4. A Study on Die Stresses in Flip Chip Package Subjected to Various Hygrothermal Exposures
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3. Investigating the Effects of Stress on Die Deformation and on Cross-Axis Offset Drift in Mode-Split MEMS Gyroscopes;IEEE Sensors Letters;2024-01
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