Generic Temperature Compensation Scheme for CMOS-MEMS Resonators Based on ARC-Beam Derived Electrical Stiffness Frequency Pulling-Reference-Cited by-同舟云学术

Generic Temperature Compensation Scheme for CMOS-MEMS Resonators Based on ARC-Beam Derived Electrical Stiffness Frequency Pulling

Published:2023-01-15 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
language:
Short-container-title:

Author:

Hsieh I-Chieh¹,Zheng Hong-Sen¹,Tsai Chun-Pu¹,Chen Ting-Yi¹,Li Wei-Chang¹

Affiliation:

1. National Taiwan University,Institute of Applied Mechanics,Taiwan

Funder

National Science and Technology Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10052111/10052113/10052231.pdf?arnumber=10052231

Reference14 articles.

1. Cmos-Mems Resonators with Sub-100-Nm Transducer Gap Using Stress Engineering

2. A negative-capacitance equivalent circuit model for parallel-plate capacitive-gap-transduced micromechanical resonators

3. A CMOS-MEMS clamped–clamped beam displacement amplifier for resonant switch applications

4. A Temperature-Insensitive CMOS-MEMS Resonator Utilizing Electrical Stiffness Compensation

5. Stiffness-compensated temperature-insensitive micromechanical resonators;hsu;Technical Digest MEMS 2002 IEEE International Conference Fifteenth IEEE International Conference on Micro Electro Mechanical Systems,2022

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Geometrically engineered mass sensing CMOS-MEMS resonators for temperature compensation via folded anchors;Sensors and Actuators A: Physical;2024-08

2. TCF-Tailoring Vertically Stepped Structures for Temperature Insensitive CMOS-MEMS Resonators;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21