Author:
Codecasa L.,D'Amore D.,Maffezzoni P.,Batty W.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
2. Structure Curve Representation of Dynamic Thermal Multi-Ports;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Determining the Contribution of Spatial Sub-Regions to Structure Functions;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28
4. Temperature-Dependent Characterization of Power Amplifiers Using an Efficient Electrothermal Analysis Technique;IEEE Transactions on Microwave Theory and Techniques;2022-02
5. Towards the Extension of TRIC for Thermo-Mechanical Analysis;2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2021-09-23