Glass Frit as a Hermetic Joining Layer in Laser Based Joining of Miniature Devices-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Glass Frit as a Hermetic Joining Layer in Laser Based Joining of Miniature Devices

Published:2010-06 Issue:2 Volume:33 Page:470-477
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Wu Qiang,Lorenz Norbert,Cannon Kevin M.,Hand Duncan P.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/5482382/05482384.pdf?arnumber=5482384

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-02

2. 皮秒激光两步扫描实现玻璃快速密封焊接;Chinese Journal of Lasers;2023

3. Ultralow Temperature Glass Frit Encapsulation for Stable Dye-Sensitized Solar Cells;ACS Applied Energy Materials;2022-11-07

4. A Laser Assisted Bonding Process Design with Silver-indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

5. Laser strengthening of additive manufactured edge seal for vacuum insulated glazing with micro-size glass frit;Journal of Building Engineering;2022-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP