A Transmitter System-in-Package at 300 GHz With an Off-Chip Antenna and GaAs-Based MMICs-Reference-Cited by-同舟云学术

A Transmitter System-in-Package at 300 GHz With an Off-Chip Antenna and GaAs-Based MMICs

Published:2019-05 Issue:3 Volume:9 Page:335-344
ISSN:2156-342X
Container-title:IEEE Transactions on Terahertz Science and Technology
language:
Short-container-title:IEEE Trans. THz Sci. Technol.

Author:

Dyck Alexander¹^ORCID,Rosch Markus¹^ORCID,Tessmann Axel¹,Leuther Arnulf¹^ORCID,Kuri Michael¹,Wagner Sandrine¹,Gashi Bersant¹^ORCID,Schafer Jochen²^ORCID,Ambacher Oliver¹

Affiliation:

1. Fraunhofer Institute for Applied Solid State Physics (IAF), Freiburg, Germany

2. Karlsruhe Institute of Technology, Karlsruhe, Germany

Funder

German Federal Ministry of Defence

Bundeswehr Technical Center for Information Technology and Electronics

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Radiation

Link

http://xplorestaging.ieee.org/ielx7/5503871/8708991/08686238.pdf?arnumber=8686238

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