Multiphysics Model of Microstrip Structure Under High Voltage Pulse Excitation
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Management of Technology and Innovation
Link
http://xplorestaging.ieee.org/ielx7/7274859/8309503/08402086.pdf?arnumber=8402086
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Recent Advances in Automated Multiphysics Parametric Modeling for Microwave Components;2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM);2023-07-15
2. Steady-State Thermal Analysis on a Real-Time Plasma Impedance Tuner for High-Power RF Matching Applications;2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS);2023-04-19
3. A Novel Electromagnetic Centric Multiphysics Parametric Modeling Approach Using Neuro-Space Mapping for Microwave Passive Components;Photonics;2022-12-10
4. Robustness study of bandpass NGD behavior of ring-stub microstrip circuit under temperature variation;International Journal of Microwave and Wireless Technologies;2021-11-23
5. Optimized Design and Multiphysics Analysis of a Ka-Band Stacked Antenna for CubeSat Applications;IEEE Journal on Multiscale and Multiphysics Computational Techniques;2021
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3