Planar Microspring—A Novel Compliant Chip-to-Package Interconnect for Wafer-Level Packaging-Reference-Cited by-同舟云学术

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Planar Microspring—A Novel Compliant Chip-to-Package Interconnect for Wafer-Level Packaging

Published:2009-05 Issue:2 Volume:32 Page:379-389
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Liao E.B.,Tay A.A.O.,Ang S.S.T.,Feng H.H.,Nagarajan R.,Kripesh V.,Kumar R.,Lo G.Q.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4982886/04529113.pdf?arnumber=4529113

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication and Mechanical Characterization of Cold Extruded Aluminum Bronze Planar Microsprings;Journal of Materials Engineering and Performance;2017-04-20

2. Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP;Microsystem Technologies;2011-11-16

3. A wafer-level multi-chip module process with thick photosensitive benzocyclobutene as the dielectric for microwave application;Journal of Micromechanics and Microengineering;2011-05-18

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