One-Component, Low-Temperature, and Fast Cure Epoxy Encapsulant With High Refractive Index for LED Applications-Reference-Cited by-同舟云学术

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One-Component, Low-Temperature, and Fast Cure Epoxy Encapsulant With High Refractive Index for LED Applications

Published:2008-08 Issue:3 Volume:31 Page:484-489
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Yan Zhou ,Nguyen Tran ,Yuan Chang Lin ,Yongzhi He ,Shi F.G.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4591479/04520268.pdf?arnumber=4520268

Cited by 40 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Synthetic Low-Odor Thiol-Based Hardeners Containing Hydroxyl and Methyl Groups on the Curing Behavior, Thermal, and Mechanical Properties of Epoxy Resins;Polymers;2023-07-04

2. High-performance thermosets for additive manufacturing;Innovation and Emerging Technologies;2023-01

3. Introduction;Reliability and Failure Analysis of High-Power LED Packaging;2023

4. REMOVED: Catalysis of reduced tin oxide in various epoxy resins;Materials Today Communications;2022-03

5. Analysis of Resistivity, Dielectric Strength and Tensibility of Insulator Materials of A Mixture of Epoxy Resin, Silicone Rubber, and Coal Ash;2021 4th International Seminar on Research of Information Technology and Intelligent Systems (ISRITI);2021-12-16

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