Polymer Optical Interconnects—A Scalable Large-Area Panel Processing Approach-Reference-Cited by-同舟云学术

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Polymer Optical Interconnects—A Scalable Large-Area Panel Processing Approach

Published:2006-02 Issue:1 Volume:29 Page:158-170
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Uhlig S.,Frohlich L.,Chen M.,Arndt-Staufenbiel N.,Lang G.,Schroder H.,Houbertz R.,Popall M.,Robertsson M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/33491/01589143.pdf?arnumber=1589143

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Body-Implantable RFID Tags Based on Ormocer Printed Circuit Board Technology;IEEE Sensors Letters;2020-08

2. Fabrication of low-loss optical interconnected waveguide using a replicated seamless large-area polymeric mold;Journal of the Korean Physical Society;2014-08

3. Flip-chip optical couplers with scalable I/O count for silicon photonics;Optics Express;2013-06-27

4. Fabrication of a Graded-Index Circular-Core Polymer Parallel Optical Waveguide Using a Microdispenser for a High-Density Optical Printed Circuit Board;IEEE Journal of Selected Topics in Quantum Electronics;2013-03

5. Graded-index core polymer optical waveguide circuit fabricated using a microdispenser for high-density on-board optical interconnects;SPIE Proceedings;2013-02-27

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