A Multiconductor Transmission Line Methodology for Global On-Chip Interconnect Modeling and Analysis-Reference-Cited by-同舟云学术

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A Multiconductor Transmission Line Methodology for Global On-Chip Interconnect Modeling and Analysis

Published:2004-02 Issue:1 Volume:27 Page:71-78
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Elfadel I.M.,Deutsch A.,Smith H.H.,Rubin B.J.,Kopcsay G.V.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/28720/01288271.pdf?arnumber=1288271

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-07

2. New differential-mode-source cable bundle crosstalk model based on multiconductor transmission lines theory;Acta Physica Sinica;2015

3. Prediction and Comparison of High-Performance On-Chip Global Interconnection;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2011-07

4. Loop-based inductance extraction and modeling for multiconductor on-chip interconnects;IEEE Transactions on Electron Devices;2006-01

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