Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
12 articles.
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1. Fast and Accurate Calculation of Mutual Inductance in the Presence of Conductive and Magnetic Media;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
2. A Wideband Model for On-Chip Interconnects With Different Shielding Structures;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-10
3. Modeling and Characterization of On-Chip Interconnects;Wiley Encyclopedia of Electrical and Electronics Engineering;2013-09-19
4. Modeling of Crosstalk in Through Silicon Vias;IEEE Transactions on Electromagnetic Compatibility;2013-02
5. Double-π fully scalable model for on-chip spiral inductors;Journal of Semiconductors;2012-08