Author:
Morsey Jason,Deutsch Alina,Libous J. P.,Surovic C.,Rubin Barry J.,Jiang Lijun,Eisenberg L.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
2 articles.
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1. Full Wave IBM Plasma Substrate Benchmark By Cadence Clarity;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
2. EMC Design Technology, Now and Future;Journal of The Japan Institute of Electronics Packaging;2018-08-01