Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package-Reference-Cited by-同舟云学术

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Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package

Published:2007-11 Issue:4 Volume:30 Page:809-822
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Muthana P.,Engin A.E.,Swaminathan M.,Tummala R.,Sundaram V.,Wiedenman B.,Amey D.,Dietz K.H.,Banerji S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4366166/04358037.pdf?arnumber=4358037

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