A Reworkable Epoxy Resin for Isotropically Conductive Adhesive-Reference-Cited by-同舟云学术

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A Reworkable Epoxy Resin for Isotropically Conductive Adhesive

Published:2004-02 Issue:1 Volume:27 Page:165-172
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Li H.,Wong C.P.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/28720/01288282.pdf?arnumber=1288282

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Multi-acrylate-based UV-curable dismantlable adhesives;International Journal of Adhesion and Adhesives;2021-01

3. Comparative Performances of Electrically Conductive Adhesives by Incorporation of Silver, Silver-Coated Copper, and Graphene;Polymer Korea;2019-09-30

4. Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly;Journal of Materials Science: Materials in Electronics;2019-02-12

5. Degradable thermosets based on labile bonds or linkages: A review;Progress in Polymer Science;2018-01

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