Novel Microcontacts in Microwave Chip Carriers Developed by UV-LIGA Process-Reference-Cited by-同舟云学术

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Novel Microcontacts in Microwave Chip Carriers Developed by UV-LIGA Process

Published:2006-02 Issue:1 Volume:29 Page:122-130
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Arnaudov R.,Avdjiiski B.,Kostov A.,Videkov V.,Andreev S.,Yordanov N.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/33491/01589139.pdf?arnumber=1589139

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Dry Film Photoresist-Based Microfabrication: A New Method to Fabricate Millimeter-Wave Waveguide Components;Micromachines;2021-03-03

2. WR-3 Band Waveguides and Filters Fabricated Using SU8 Photoresist Micromachining Technology;IEEE Transactions on Terahertz Science and Technology;2012-11

3. Design and realisation of low loss air-filled rectangular coaxial cable with bent quarter-wavelength supporting stubs;Microwave and Optical Technology Letters;2008

4. Novel Microcontacts in Microwave Chip Carriers Developed by UV-Liga Process Part II;IEEE Transactions on Advanced Packaging;2006-08

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