A Low-Temperature SU-8 Based Wafer-Level Hermetic Packaging for MEMS Devices-Reference-Cited by-同舟云学术

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A Low-Temperature SU-8 Based Wafer-Level Hermetic Packaging for MEMS Devices

Published:2009-05 Issue:2 Volume:32 Page:448-452
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Zine-El-Abidine I.,Okoniewski M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4982886/04804684.pdf?arnumber=4804684

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Origami-Inspired Fabrication of High-Performance Wafer-Level Packaged Three-Dimensional Radio-Frequency Inductors;Journal of Microelectromechanical Systems;2023-08

2. Microadditive Manufacturing Technologies of 3D Microelectromechanical Systems;Advanced Engineering Materials;2021-10-24

3. Experiment and analysis of the effect of BCB sealing ring flatness on BCB cap transfer packaging;Microsystem Technologies;2020-07-01

4. Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems;Sensors;2020-04-10

5. Challenges and Issues of Using Polymers as Structural Materials in MEMS: A Review;Journal of Microelectromechanical Systems;2018-08

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