A Small-Area Integration of Optical Receiver Using Multi-Layer Inductors and Capacitor-Under-Pad-Reference-Cited by-同舟云学术

A Small-Area Integration of Optical Receiver Using Multi-Layer Inductors and Capacitor-Under-Pad

Published:2022-08-07 Issue: Volume: Page:
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Container-title:2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS)
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Author:

Tsuchiya Akira¹,Inoue Toshiyuki¹,Kishine Keiji¹,Takahashi Yasuhiro²,Ito Daisuke²,Nakamura Makoto²

Affiliation:

1. The University of Shiga Prefecture, Hikone-shi,Dept. Electronic Systems Engineering,Shiga,Japan

2. Gifu University,Dept. Electrical, Electronic and Computer Engineering,Gifu-shi, Gifu,Japan

Funder

National Institute of Information and Communications Technology

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9859262/9859267/09859435.pdf?arnumber=9859435

Reference11 articles.

1. New design approach of vertical inductors for high-frequency integrated circuits

2. On-chip vertically coiled solenoid inductors and transformers for RF SoC using 90nm CMOS interconnect technology

3. A 53-Gbit/s Optical Receiver Frontend With 0.65 pJ/bit in 28-nm Bulk-CMOS

4. 22.2A 25Gb/s hybrid integrated silicon photonic transceiver in 28nm CMOS and SOI;chen;IEEE International Solid-State Circuits Conference (ISSCC) Digest of Technical Papers,2015

5. A 40Gb/s Transimpedance-AGC Amplifier with 19dB DR in 90nm CMOS

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