Influence of Printed Encapsulation Layer on the Mechanical Reliability and Performance of V₂O₅ Nanowires-Based Flexible Temperature Sensors
Author:
Affiliation:
1. James Watt School of Engineering, University of Glasgow, Glasgow, U.K.
2. ECE Department, Northeastern University, Boston, MA, USA
Funder
European commission through the NeuTouch Innovative Training Network
Engineering and Physical Sciences Research Council through the Engineering Fellowship for Growth
Hetero-Print Programme
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/9552934/10176169/10052646.pdf?arnumber=10052646
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1. Ultrathin Ion-Sensitive Field-Effect Transistor Chips with Bending-Induced Performance Enhancement
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4. Self assembled V2O5 nanorods for gas sensors
5. Multifunctional Electronic Skin With a Stack of Temperature and Pressure Sensor Arrays
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Modular Platform for Automated Characterisation of Printed Structures, Devices and Circuits;2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP);2024-06-02
2. Device Reliability and Effect of Temperature on Memristors: Nanostructured V₂O₅;IEEE Transactions on Device and Materials Reliability;2024-06
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