Affiliation:
1. Bendable Electronics and Sensing Technologies (BEST) Group, James Watt School of Engineering, University of Glasgow, Glasgow, U.K.
Funder
Engineering and Physical Science Research Council (EPSRC) through the Engineering Fellowship
Programme Grant-Heteroprint
Impact Acceleration Accounts
North West Centre for Advanced Manufacturing Project
European Union’s INTERREG Programme, managed by the Special EU Programmes Body
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Cited by
57 articles.
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