Three-dimensional circuit fabrication using four-dimensional printing and direct ink writing-Reference-Cited by-同舟云学术

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Three-dimensional circuit fabrication using four-dimensional printing and direct ink writing

Published:2016-08 Issue: Volume: Page:
ISSN:
Container-title:2016 International Symposium on Flexible Automation (ISFA)
language:
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Author:

Deng Dongping,Jain Archit,Yodvanich Narut,Araujo Arthur,Chen Yong

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7777660/7790124/07790176.pdf?arnumber=7790176

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Liquid-Based 4D Printing of Shape Memory Nanocomposites: A Review;Journal of Manufacturing and Materials Processing;2023-01-31

2. Research of 3D Printing Technology for Silver Paste based on Direct Ink Writing;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Knowledge mapping of 4D printing technologies in computer engineering;Computer Applications in Engineering Education;2022-08-05

4. 4D Printing of a Fully Biobased Shape Memory Copolyester via a UV-Assisted FDM Strategy;ACS Sustainable Chemistry & Engineering;2022-05-04

5. A Survey of 3D Printing Technologies as Applied to Printed Electronics;IEEE Access;2022

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