Understanding Inherent Implication of Thermal Resistance in Double-Side Cooling Module-Reference-Cited by-同舟云学术

Understanding Inherent Implication of Thermal Resistance in Double-Side Cooling Module

Published:2023-02 Issue:2 Volume:38 Page:2435-2445
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Han Lubin¹,Liang Lin¹^ORCID,Zhang Ziyang¹,Kang Yong¹

Affiliation:

1. State Key Laboratory of Advanced Electromagnetic Engineering and Technology, Power Electronics and Energy Management Key Laboratory, Ministry of Education of China, School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9952160/09887903.pdf?arnumber=9887903

Reference31 articles.

1. Requirements in power cycling for precise lifetime estimation

2. Transient Thermal Response Measurements of Power Transistors

3. Packaging Architectures for Silicon Carbide Power Electronic Modules

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