Frequency-Domain Thermal Modeling of Power Modules Based on Heat Flow Spectrum Analysis-Reference-Cited by-同舟云学术

Frequency-Domain Thermal Modeling of Power Modules Based on Heat Flow Spectrum Analysis

Author:

Xu Mengqi¹^ORCID,Ma Ke²^ORCID,Zhong Quan¹^ORCID,Liserre Marco³^ORCID

Affiliation:

1. Key Laboratory of Control of Power Transmission and Conversion, Ministry of Education, Shanghai Jiao Tong University, Shanghai, China

2. Department of Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China

3. Chair of Power Electronics, Christian-Albrechts University of Kiel, Kiel, Germany

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

Reference26 articles.

2. In-situ thermal impedance spectroscopy of power electronic modules for localized degradation identification;van der broeck;Proc PCIM Eur Conf,2019

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