A Novel Evaluation Methodology for the Reliability and Lifetime of 200 mm E-Mode GaN-on-Si Power HEMTs
Author:
Affiliation:
1. School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China
2. GaNext Technology Company Limited, Zhuhai, China
3. National Laboratory of Science and Technology on Analog Integrated Circuits, Chongqing, China
Funder
National Natural Science Foundation of China
Natural Science Foundation Project of CQ CSTC
National Laboratory of Science and Technology on Analog Integrated Circuit
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/10067244/10021987.pdf?arnumber=10021987
Reference25 articles.
1. High-Voltage and Low-Leakage AlGaN/GaN Tri-Anode Schottky Diodes With Integrated Tri-Gate Transistors
2. Investigating the Current Collapse Mechanisms of p-GaN Gate HEMTs by Different Passivation Dielectrics
3. Foundry process qualification guidelines,2014
4. Proposal of a GaN/SiC Hybrid Field-Effect Transistor for Power Switching Applications
5. Interface Charge Effects on 2-D Electron Gas in Vertical-Scaled Ultrathin-Barrier AlGaN/GaN Heterostructure
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