A Comprehensive Design Method for Multichip Double-Sided Cooling Power Module With Multidimensional Self-and Mutual Inductances
Author:
Affiliation:
1. College of Electrical Engineering and Automation, Hefei University of Technology, Hefei, China
2. Institute of Energy, Hefei Comprehensive National Science Center, (Anhui Energy Laboratory), Hefei, China
Funder
University Synergy Innovation Program of Anhui Province
Institute of Energy
Hefei Comprehensive National Science Center
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/63/10566505/10475579.pdf?arnumber=10475579
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1. Power Semiconductor Devices for Smart Grid and Renewable Energy Systems
2. Changes and challenges of photovoltaic inverter with silicon carbide device
3. Influences of Device and Circuit Mismatches on Paralleling Silicon Carbide MOSFETs
4. Research and measurement of chip current imbalance in IGBT module with multiple chips in parallel
5. Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement
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