High Performance SiC Power Module Based on Repackaging of Discrete SiC Devices

Author:

Chen Zibo1ORCID,Huang Alex Q.1ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, University of Texas at Austin, Austin, TX, USA

Funder

Oak Ridge National Laboratory

U.S. Department of Energy

Office of Electricity's

Transformer Resilience and Advanced Components

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Reference13 articles.

1. A high power density 75 kVA air-cooled SiC intelligent power stage (IPS) as a universal building block for grid applications;chen;Proc IEEE Appl Power Electron Conf Expo,2023

2. Turn-on performance comparison of SiC single driver module (SDM) and multi-driver module (MDM);liu;Proc IEEE Energy Convers Congr Expo,2020

3. Turn-on Gate Resistor Optimization For Paralleled SiC MOSFETs

4. 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding

5. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues

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1. Extreme high efficiency enabled by silicon carbide (SiC) power devices;Materials Science in Semiconductor Processing;2024-03

2. Influence of JFET Width on Short-Circuit Robustness of 1200 V SiC Power MOSFETs;Electronics;2023-11-30

3. Enhanced Thermal Performance of Power Module with Integrated AlN Ceramic Heatsink;2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS);2023-11-10

4. High Power Converter Busbar in the New Era of Wide-Band-Gap Power Semiconductor;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

5. Design and Implementation of a 12 kW Scalable Electronic-Embedded Transformer (EET)-based DC Transformer (DCX) with Trapezoidal Current;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

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