A Review of Architectural Design and System Compatibility of Power Modules and Their Impacts on Power Electronics Systems
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9471017/09385950.pdf?arnumber=9385950
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Substrate Embedded Power Electronics Packaging for Silicon Carbide mosfets;IEEE Transactions on Power Electronics;2024-08
2. A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module;CES Transactions on Electrical Machines and Systems;2024-03
3. Review of Hybrid Packaging Methods for Power Modules;Chinese Journal of Electrical Engineering;2023-12
4. Fabrication Process Optimization of A High- Power Double-Sided Cooled SiC Power Module;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29
5. Parallel Connection of Silicon Carbide MOSFETs—Challenges, Mechanism, and Solutions;IEEE Transactions on Power Electronics;2023-08
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