Investigation of Solder Void Improvement on Automotive Parts
Author:
Affiliation:
1. Nexperia Malaysia Sdn. Bhd.,Package R&D Department,Seremban,Malaysia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9969384/9969385/09969499.pdf?arnumber=9969499
Reference5 articles.
1. Vacuum Reflow Process Characterization for Void-Less Soldering Process in Semiconductor Package
2. Real Time X-ray Analysisof Void Formation and Dynamics in QFN Devices DuringReflow;kullar;Proc Surf Mount Technol Assoc Int Conf (SMTA),2019
3. The Effect of Vacuum Reflow Processing on Solder Joint Voiding and Thermal Fatigue Reliability;coyle;Proc Surface Mount Tech Assoc Int (SMTA),2016
4. Vacuum reflow: A simple approach for void reduction by means of an inline reflow system;wertheim;CIRCE Tech Rep,2012
5. Performance and Reliability Requirements for the Application of SiC Power MOSFET in Electrified Vehicle Drive Systems
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