Cyber-Physical Integration for Future Green Seaports: Challenges, State of the Art and Future Prospects
Author:
Affiliation:
1. Department of Electrical Engineering, Chongqing University, Chongqing, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/9984155/10053577/10144663.pdf?arnumber=10144663
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