Data-Based Approach for Final Product Quality Inspection: Application to a Semiconductor Industry-Reference-Cited by-同舟云学术

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Data-Based Approach for Final Product Quality Inspection: Application to a Semiconductor Industry

Published:2021-12-14 Issue: Volume: Page:
ISSN:
Container-title:2021 60th IEEE Conference on Decision and Control (CDC)
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Author:

Al-Kharaz Mohammed¹,Ananou Bouchra¹,Ouladsine Mustapha¹,Combal Michel²,Pinaton Jacques²

Affiliation:

1. Université de Toulon, CNRS, LIS,Aix Marseille Univ,Marseille,France

2. STMicroelectronics,Process Control Department,Rousset,France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9682670/9682776/09683231.pdf?arnumber=9683231

Reference16 articles.

1. An artificial neural network approach for wafer dicing saw quality prediction

2. Feature-based Virtual Metrology for Semiconductor Manufacturing

3. Next-generation virtual metrology for semiconductor manufacturing: A feature-based framework

4. Quality Prediction in Semi-conductor Manufacturing processes Using Multilayer Perceptron Feedforward Artificial Neural Network*;al-kharaz;2019 8th ICSC,2019

5. Nonlinear Component Analysis as a Kernel Eigenvalue Problem

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Challenges for Predictive Quality in Multi-stage Manufacturing: Insights from Literature Review;Proceedings of the 3rd International Workshop on Software Engineering and AI for Data Quality in Cyber-Physical Systems/Internet of Things;2023-12-04

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