Lithography with high depth of focus by an ion projection system

Author:

Buchmann L.-M.1,Schnakenberg U.1,Torkler M.1,Loschner H.,Stengl G.,traher C.,Fallmann W.,Stangl G.,Cekan E.

Affiliation:

1. Fraunhofer-Inst. fuer Mikrostrukturtech., Berlin, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Multi-aperture extraction system with micro-beamlet switching capability;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2001-11

2. Ion Projection Lithography for Nano Patterning;MRS Proceedings;1999

3. DUV resist UV II HS applied to high resolution electron beam lithography and to masked ion beam proximity and reduction printing;Microelectronic Engineering;1998-03

4. HPR 506 photoresist used as a positive tone ion resist;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1996-11

5. Ion projection lithography over wafer topography;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1994-11

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