High Density Integration/Multi-Function Assemblies, Photonics, and mm-Wave components

Author:

Gutierrez-Aitken A.1

Affiliation:

1. Northrop Grumman Space Systems,Redondo Beach,CA,USA

Publisher

IEEE

Reference15 articles.

1. Ultra compact, light weight T/R modules constructed by hermetic wafer-level packaging technology

2. III-V Wafer Level Packaging;ferizovic;CS MANTECH Workshop 6,2016

3. MMIC Compatible Wafer Level Packaging;ferizovic;Microelectronics Reliability and Qualification Workshop,2020

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Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Thermal Analysis of 3D Heterogeneous Integration for Microwave HEMTs;2023 IEEE XVI International Scientific and Technical Conference Actual Problems of Electronic Instrument Engineering (APEIE);2023-11-10

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