Effects of design, structure and material on thermal-mechanical reliability of large array wafer level packages-Reference-Cited by-同舟云学术

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Effects of design, structure and material on thermal-mechanical reliability of large array wafer level packages

Published:2009-08 Issue: Volume: Page:
ISSN:
Container-title:2009 International Conference on Electronic Packaging Technology & High Density Packaging
language:
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Author:

Varia Bhavesh,Fan Xuejun,Han Qiang

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5234372/5270539/05270586.pdf?arnumber=5270586

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