Fatigue lifetime prediction of a novel interface material with plastic failure for power electronics packaging-Reference-Cited by-同舟云学术

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Fatigue lifetime prediction of a novel interface material with plastic failure for power electronics packaging

Published:2008-05 Issue: Volume: Page:
ISSN:1087-9870
Container-title:2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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Author:

Guang-Cheng Dong ,Xu Chen ,Guo-Quan lu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4538254/4544243/04544348.pdf?arnumber=4544348

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Ag Sintered Bondline Thickness on High-Temperature Reliability of SiC Power Devices;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-11

2. Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material;JOM;2019-04-10

3. Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions;Microelectronics Reliability;2015-12

4. Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?;Journal of Electronic Materials;2014-01-17

5. A High-Temperature SiC Three-Phase AC–DC Converter Design for >$100 ^{\circ}$C Ambient Temperature;IEEE Transactions on Power Electronics;2013-01

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