Research and Application of Defect Detection Method for Electronic Wafer Based on Machine Vision

Author:

Qin Jieli1

Affiliation:

1. Xiamen Institute of Technology,The Higher Educational Key Laboratory for Flexible Manufacturing Equipment Integration of Fujian Province,Xiamen,China,361021

Publisher

IEEE

Reference15 articles.

1. Chip and digital economy, balance of short-term and long-term interests;Wang;Times of Fortune,2021

2. Semiconductor Wafer Bonding - A Review of Interfacial Properties and Applications;Bengtsson;Journal of Electronic Materials,1992

3. The Semiconductor Quality Management Using The Map Pattern Index

4. Bin2Vec: A Better Wafer Bin Map Coloring Scheme for Comprehensible Visualization and Effective Bad Wafer Classification

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