A Equivalent Circuit for Rapid Reproduction of IGBT Transient Thermal Impedance Graph
Author:
Affiliation:
1. Beijing Smart-Chip Microelectronics Technology Co., Ltd,State Grid Key Laboratory of Power Industrial Chip Reliability Technology,Beijing,China
2. State Grid Chongqing Electric Power Company Electric Power Research Institute,Chongqing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10218344/10218369/10218645.pdf?arnumber=10218645
Reference10 articles.
1. Thermal network parameter identification of IGBT module based on the cooling curve of junction temperature
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