Ka-Band AiP Array in Mold-on-Mold FOWLP technology-Reference-Cited by-同舟云学术

Ka-Band AiP Array in Mold-on-Mold FOWLP technology

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
language:
Short-container-title:

Author:

Mei Sun¹,Guan Lim Teck¹,Lin Zhou¹,Zheng Kai Bo¹,Chinq Jong Ming¹,Long Lau Boon¹

Affiliation:

1. Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research),Singapore,138634

Publisher

IEEE

Link

Reference6 articles.

1. FOWLP AiP Optimization for Automotive Radar Applications;sun;2021 IEEE electronic component and technology conference (ECTC),2021

2. 77GHz Cavity Backed AiP Array in FOWLP Technology;sun;2022 IEEE Electronic Components and Technology Conference (ECTC),2022

4. FOWLP AiP for SOTM Applications;sun;2022 IEEE Electronic Components and Technology Conference (ECTC),2022

5. Dual Polarized FOWLP AiP for 5G Base Station Applications;sun;2021 Electronics Packaging Technology Conference (EPTC),2021

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-wideband Antenna in Package with Dual Polarizations;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Characterization of FOWLP Antenna in Packages;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05