Thermal and RF Characterization of Novel PLA/Flax Based Biodegradable Printed Circuit Boards-Reference-Cited by-同舟云学术

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Thermal and RF Characterization of Novel PLA/Flax Based Biodegradable Printed Circuit Boards

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Geczy Attila¹,Csiszar Andras²,Xavier Pascal³,Corrao Nicolas³,Rauly Dominique³,Kovacs Robert⁴,Feher Anna Eva⁴,Rozs Egon¹,Gal Laszlo¹

Affiliation:

1. Budapest University of Technology and Economics,Faculty of Electrical Engineering and Informatics,Department of Electronics Technology

2. Meshlin Composites Zrt.,Hungary

3. University Grenoble Alpes, Uniersity Savoie Mont Blanc,CNRS, Grenoble INP, IMEP-LAHC,France

4. Budapest University of Technology and Economics,Faculty of Mechanical Engineering,Department of Energy Engineering

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013255.pdf?arnumber=10013255

Reference13 articles.

1. A Tale of Two Mice: Sustainable Electronics Design and Prototyping

2. Novel PLA/Flax Based Biodegradable Printed Circuit Boards

3. Bioplastics and Carbon-Based Sustainable Materials, Components, and Devices: Toward Green Electronics

4. Thermal properties of samples prepared from polylactic acid by 3D printing

5. Design and Evaluation of Bioepoxy-Flax Composites for Printed Circuit Boards

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bulge-Free and Homogeneous Metal Line Jet Printing with StarJet Technology;Micromachines;2024-05-31

2. Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges;International Journal of Precision Engineering and Manufacturing;2024-05-14

3. Decomposition study of sustainable biodegradable Printed Circuit Boards;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

4. Sustainable Printed Circuit Board Substrates Based on Flame-Retarded Pla/Flax Composites to Reduce Environmental Load of Electronics: Quality, Reliability, Degradation and Application Tests;2023

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