Plasma Jet Deposition and Self-Sintering of Gold Nanoparticle Ink for Flexible Electronics-Reference-Cited by-同舟云学术

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Plasma Jet Deposition and Self-Sintering of Gold Nanoparticle Ink for Flexible Electronics

Published:2023-08-13 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Flexible Electronics Technology Conference (IFETC)
language:
Short-container-title:

Author:

Manzi Jacob¹,Varghese Tony²,Dhamala Anupama³,Prakasan Lakshmi¹,Eixenberger Josh²,Kandadai Nirmala¹,Estrada David²,Subbaraman Harish¹

Affiliation:

1. School of Electrical Engineering and Computer Science, Oregon State University,Corvallis,OR,USA,97331

2. Micron School of Material Science and Engineering, Boise State University,Boise,ID,USA,83725

3. Boise State University,Department of Electrical and Computer Engineering,Boise,ID,USA,83725

Funder

NASA EPSCoR

NSF

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10254736/10254789/10254892.pdf?arnumber=10254892

Reference15 articles.

1. Argon plasma sintering of inkjet printed silver tracks on polymer substrates

2. Plasma-jet printing of colloidal thermoelectric Bi₂Te₃ nanoflakes for flexible energy harvesting

3. Residual stress and structural characteristics in Ti and Cu sputtered films on glass substrates at different substrate temperatures and film thickness

4. Gold thin-film electrodes: an EQCM study of the influence of chromium and titanium adhesion layers on the response

5. Atmospheric Pressure Plasma Printing of Nanomaterials for IoT Applications

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ligand Decomposition Differences during Thermal Sintering of Oleylamine-Capped Gold Nanoparticles in Ambient and Inert Environments: Implications for Conductive Inks;ACS Applied Nano Materials;2023-12-13

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