Author:
Cheung Y.M,Chong Arthur C. M.,Huang B.
Cited by
6 articles.
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1. Competing behavior of interface delamination and wafer cracking during peeling film from ultra-thin wafer;International Journal of Solids and Structures;2024-12
2. Adhesive Fracture Analysis of Die Attach Film-Laminated Tape by 90° Peel Tests and Finite Element Analysis;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. Vacuum-Based Picking-up and Placing-on;Modeling and Application of Flexible Electronics Packaging;2019
4. Single-needle Peeling;Modeling and Application of Flexible Electronics Packaging;2019
5. Advanced Electronic Packaging;Modeling and Application of Flexible Electronics Packaging;2019