Reliability studies of surface mount solder joints - effect of Cu-Sn intermetallic compounds-Reference-Cited by-同舟云学术

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Reliability studies of surface mount solder joints - effect of Cu-Sn intermetallic compounds

Published:1996 Issue:3 Volume:19 Page:661-668
ISSN:1070-9894
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. B

Author:

So A.C.K.,Chan Y.C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/96/11172/00533909.pdf?arnumber=533909

Cited by 69 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The role of Sn grain orientation in Cu depletion of Sn-based solders;Modelling and Simulation in Materials Science and Engineering;2024-07-05

2. Snagcu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux;2024

3. Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design;Processes;2023-09-11

4. Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint;Journal of Materials Science: Materials in Electronics;2022-09-19

5. Evaluation of Long-term Stability of Bismuth-Tin Solder Joint Properties in Dependence on Reflow Conditions;2021 44th International Spring Seminar on Electronics Technology (ISSE);2021-05-05

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