The heat-flow problem in silicon: An approach to an analytical solution with application to the calculation of thermal instability in bipolar devices
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/16/31783/01479753.pdf?arnumber=1479753
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Analytical modeling and numerical simulations of the thermal behavior of trench-isolated bipolar transistors on SOI substrates;Solid-State Electronics;2008-05
2. Theory of electrothermal behavior of bipolar transistors: part III-impact ionization;IEEE Transactions on Electron Devices;2006-07
3. Theory of Electrothermal Behavior of Bipolar Transistors: Part I—Single-Finger Devices;IEEE Transactions on Electron Devices;2005-09
4. Small-signal operation of semiconductor devices including self-heating, with application to thermal characterization and instability analysis;IEEE Transactions on Electron Devices;2001
5. Thermal Modeling of Integrated Circuits;IETE Journal of Research;1992-01
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