Planar Electrical Capacitance Tomography Dynamic Imaging for Non-Destructive Test
Author:
Affiliation:
1. School of Electrical and Information Engineering, Tianjin University, Tianjin, China
2. Department of Automation, North China Electric Power University, Baoding, China
Funder
National Natural Science Foundation of China
Independent Innovation Foundation of Tianjin University
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/19/9717300/09789419.pdf?arnumber=9789419
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