Robotic Patch Clamp Based on Noninvasive 3-D Cell Morphology Measurement for Higher Success Rate
Author:
Affiliation:
1. Institute of Robotics and Automatic Information System (IRAIS) and the Tianjin Key Laboratory of Intelligent Robotic (tjKLIR), Nankai University, Tianjin, China
Funder
National Natural Science Foundation of China
Beijing Advanced Innovation Center for Intelligent Robots and Systems
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/19/9717300/09839559.pdf?arnumber=9839559
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