Author:
Chun C.,Pham A.,Laskar J.,Hutchison B.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
15 articles.
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1. A Methodology for RF modeling of packages with external pin measurements;International Journal of RF and Microwave Computer-Aided Engineering;2014-04-11
2. Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-02
3. Electrical modeling of packaged GaN HEMT dedicated to internal power matching in S-band;International Journal of Microwave and Wireless Technologies;2012-07-16
4. Electrical characterization of a RF power transistor ceramic package including multiple wirebonds;International Journal of RF and Microwave Computer-Aided Engineering;2012-05-10
5. On-chip spiral inductor in flip-chip technology;International Journal of Microwave and Wireless Technologies;2009-10