Author:
Belov Ilja,Lindgren Mats,Leisner Peter,Bergner Fredrik,Bornoff Robin
Cited by
11 articles.
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1. Thermal Assessment of Soldering MLCC Components;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Digital Twin in Manufacturing: Reflow Soldering Process;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
3. A review on numerical approach of reflow soldering process for copper pillar technology;The International Journal of Advanced Manufacturing Technology;2022-07-18
4. Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering;Recent Progress in Lead-Free Solder Technology;2022
5. Simulation, Optimization and Experimental Verification of the Over–Pressure Reflow Soldering Process;Procedia CIRP;2017