Measurements of the solders surface tension values-Reference-Cited by-同舟云学术

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Measurements of the solders surface tension values

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Container-title:7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
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Author:

Urbanek J.,Dusek K.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10938/34453/01643983.pdf?arnumber=1643983

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type;Applied Surface Science;2024-09

2. A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation;Materials;2024-06-02

3. Methodology for Solderability Measurement of Plated Through Holes Using Wetting Balance Test;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

4. Comment on: “Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance”;Scripta Materialia;2021-04

5. Thermomechanical Stress-Aware Management for 3-D IC Designs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2017-09

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